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Potting glue series

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Silicone Potting Compound

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1. Features of product series
● Addition type and condensation type potting protection
● Room temperature curing or heating fast curing
● A variety of rheological properties to meet the different needs of customers
● A variety of stepped heat conduction products to meet different thermal management needs
● -50℃～ Long-term elasticity at 200℃
● Excellent electrical properties
● Compliant with UL, RoHS, Reach requirements

2. Product use
● Long-term protection against moisture and air pollution for high-purity electronic products
● IGBT potting protection
● Shockproof protection for precision mechanical parts
● Protection of precision electrical circuits and hybrid circuits, potting of small electrical appliances Protection
● Potting and sealing of power battery modules
● Potting and sealing of display devices

product name	3100	3100S	3100HD	3200	3300	5300
product type	Two-component addition type potting compound	Two-component addition type potting compound	Two-component addition type thermally conductive potting compound	two-component addition gel	Two-component addition type adhesive potting glue	Two-component addition type thermally conductive potting compound
Curing method	room temperature curing Heating accelerates curing	room temperature curing Heating accelerates curing	room temperature curing Heating accelerates curing	room temperature curing Heating accelerates curing	room temperature curing Heating accelerates curing	room temperature curing Heating accelerates curing
color	black/gray/white	black/gray/white	black/gray/white	transparent	black	grey White
Before curing
Exterior	flow	flow	flow	flow	flow	flow
Mixing ratio (mass)	1:1	1:1	1:1	1:1	1:1	1:1
Mixed viscosity (25℃,cP)	1200	2000	3500	500	1200	4500
Working time (25℃, min)	20	20	40	30	30	60
curing time	4h@25℃ 30min@80℃	4h@25℃ 30min@80℃	4h@25℃ 30min@100℃	6h@25℃ 30min@100℃	6h@25℃ 30min@100℃	6h@25℃ 30min@100℃
after curing
Density (g/cm3)	1.4	1.4	1.7	1.0	1.0	2.6
Hardness (Shore)	A 40	A 15	A 50	00 20	A 15	A 40
Tensile strength (MPa)	1.5	2.5	2.2	0.8	1.8	2.5
Elongation at break (%)	65	140	70	260	180	55
Thermal conductivity (W/m∙K)	0.6	0.6	0.8	0.2	0.2	1.5
Volume resistivity (Ω∙cm)	≥1×1014	≥1×1014	≥1×1014	≥1×1014	≥1×1014	≥1×1014
Breakdown voltage (kV/mm)	≥18	≥18	≥16	≥18	≥18	≥16
flame retardant	UL 94V-0	UL 94V-0	UL 94V-0	UL 94HB	UL 94HB	UL 94V-0
Environmental certification	RoHS/Reach	RoHS/Reach	RoHS/Reach	RoHS/Reach	RoHS/Reach	RoHS/Reach
product name	5300H	5360	9300	9300H	6300	4100LV
product type	Two-component addition type thermally conductive potting compound	Two-component addition type thermally conductive potting compound	Two-component potting foam	Two-component low-density potting compound	Two-component condensation type potting adhesive	Two-component condensation type potting adhesive
Curing method	room temperature curing Heating accelerates curing	room temperature curing Heating accelerates curing	room temperature curing Heating accelerates curing	room temperature curing Heating accelerates curing	room temperature curing	room temperature curing
color	grey White	pink white	black/gray/white	black/gray/white	grey White	grey White
Before curing
Exterior	flow	flow	flow	flow	flow	flow
Mixing ratio (volume or mass)	1:1	1:1	1:1	1:1	10:1	1:1
Mixed viscosity (25℃,cP)	6000	7000	4000	4000	3000	5000
Working time (25℃, min)	60	60	10	10	30	15
curing time	6h@25℃ 30min@100℃	6h@25℃ 30min@100℃	2h@25℃	2h@25℃	24h@25℃	24h@25℃
after curing
Density (g/cm3)	2.6	2.8	0.3	0.6	1.4	1.3
Hardness (Shore)	A 40	A 25	A 10	A 20	A 45	A 40
Tensile strength (MPa)	2.2	2.0	0.5	0.8	1.5	0.8
Elongation at break (%)	50	65	80	40	90	65
Thermal conductivity (W/m∙K)	2.0	2.4	0.1	0.1	0.6	0.5
Volume resistivity (Ohm∙cm)	≥1×1014	≥1×1014	≥1×1014	≥1×1014	≥1×1014	≥1×1014
Breakdown voltage (kV/mm)	≥16	≥16	≥18	≥18	≥18	≥18
flame retardant	UL 94V-0	UL 94V-0	UL 94V-0	UL 94V-0	UL 94V-0	UL 94HB
Environmental certification	RoHS/Reach	RoHS/Reach	RoHS/Reach	RoHS/Reach	RoHS/Reach	RoHS/Reach

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The company mainly produces and operates solder paste, solder bars, solder wire, anode plates (rods), anode balls and other related electronic welding materials.