PRODUCTS

PRODUCTS

+
  • 202336(1).jpg

Adhesive series


Category:

Silicone Potting Compound

Keywords:

Details

Details


Adhesive series products have various types of condensation curing systems and addition curing systems. Condensation curing system has the characteristics of convenient use and good adhesion to various conventional substrates, and is widely used in the bonding and fixing of various conventional components and components; addition curing system has higher temperature resistance than condensation curing system, Heat fast curing performance, used in a variety of challenging areas of the process.


1. Features of the product series
● Condensation-type products are fast to dry and fully cured after 48 hours
● Addition-type products are quickly cured or heat-cured
● Good adhesion to common substrates
● Various rheological products meet the needs of customers in different construction conditions
● A variety of stepped heat conduction products meet different thermal management needs
● Excellent flame retardant performance, passed UL94V-0 certification
● Excellent electrical insulation performance
● Comply with RoHs environmental protection requirements


2. Product use
● Bonding and reinforcement of electronic components
● Assembly and reinforcement of power modules ● Assembly and sealing of
lamps ●
Bonding assembly and sealing of auto parts
● Assembly of ordinary components
● Sealing and bonding of battery components

 

Product grade

2100

2100HT

2100N

2180

2300

2300LV

2320

features

One-component dealcoholization condensation type

One-component dealcoholization condensation type

One-component dealcoholization condensation type

One-component dealcoholization condensation type

One-component dealcoholization condensation type

One-component dealcoholization condensation type

One-component dealcoholization condensation type

Exterior

Thixotropic paste

micro flow

micro flow

Thixotropic paste

semi-fluid

flow

flow

color

black White

black White

black White

black/gray/white

black White

black White

translucent

Density (g/cm3)

1.7

1.9

1.5

1.4

1.3

1.3

1.0

viscosity

N.A

N.A

200000

N.A

40000

20000

20000

Before curing

 

The mixing ratio

N.A

N.A

N.A

N.A

N.A

N.A

N.A

Surface dry time (min)

15

10

6

15

20

20

15

Operating time (min)

N.A

N.A

N.A

N.A

N.A

N.A

N.A

curing conditions

Room temperature moisture curing

Room temperature moisture curing

Room temperature moisture curing

Room temperature moisture curing

Room temperature moisture curing

Room temperature moisture curing

Room temperature moisture curing

after curing

 

Hardness (Shore A)

65

70

40

40

35

35

25

Tensile strength (MPa)

2.0

2.2

1.5

2.2

1.5

1.6

0.8

Elongation at break (%)

70

60

15

300

160

130

120

Shear strength (MPa, Al-Al)

1.2

1.3

1.2

1.6

1.3

1.3

0.8

Thermal conductivity (W/m∙K)

0.8

1.0

0.6

0.5

0.4

0.4

0.2

Breakdown voltage (kV/mm)

≥18

≥18

≥18

≥18

≥18

≥18

≥18

Volume resistance (Ohm∙cm)

≥1×1014

≥1×1014

≥1×1014

≥1×1014

≥1×1014

≥1×1014

≥1×1014

Flame retardant grade

UL 94V-0

UL 94V-0

UL 94V-0

N.A

UL 94V-0

UL 94V-0

N.A

 

 

Product grade

2345

2600

2620

2800

4100L

4100

6200

features

One-component dealcoholization condensation type

One-component dealcoholization condensation type

One-component deketoxime condensation type

One-component addition type

Two-component condensation type

Two-component condensation type

One-component dealcoholization condensation type

Exterior

Thixotropic paste

micro flow

flow

semi-fluid

semi-fluid

Thixotropic

semi-fluid

color

translucent

White

red

translucent

black

black

black/gray/white

Density (g/cm3)

1.1

1.7

1.1

1.1

1.2

1.4

1.3

viscosity

N.A

N.A

6000

N.A

40000

200000

100000

Before curing

 

Mixing Ratio (Mass)

N.A

N.A

N.A

N.A

1:1

1:1

N.A

Surface dry time (min)

15

7

15

N.A

10

10

15

Operating time (min)

N.A

N.A

N.A

N.A

5

5

N.A

curing conditions

Room temperature moisture curing

Room temperature moisture curing

Room temperature moisture curing

30min@150℃

24h@25℃

24h@25℃

Room temperature moisture curing

after curing

 

Hardness (Shore A)

50

60

27

40

35

50

40

Tensile strength (MPa)

5.0

2.0

0.8

5

1.2

2.5

1.6

Elongation at break (%)

350

120

150

300

130

150

160

Shear strength (MPa, Al-Al)

2.0

1.5

0.8

3

1.0

1.5

1.2

Thermal conductivity (W/m∙K)

0.4

0.8

0.3

0.4

0.4

0.6

0.5

Breakdown voltage (kV/mm)

≥20

≥18

≥18

≥18

≥18

≥18

≥18

Volume resistance (Ohm∙cm)

≥1×1014

≥1×1014

≥1×1014

≥1×1014

≥1×1014

≥1×1014

≥1×1014

Flame retardant grade

N.A

UL 94V-0

N.A

N.A

N.A

N.A

UL 94V-0

ONLINE MESSAGE

*Note: Please be sure to fill in the information accurately, and keep the communication unblocked, we will get in touch with you as soon as possible

The company mainly produces and operates solder paste, solder bars, solder wire, anode plates (rods), anode balls and other related electronic welding materials.

The company mainly produces and operates polyurethane potting adhesives, sealants, and structural adhesives.

Hong Kong Chengxing Group Co., Ltd.

Tel:(852)27954549

Add:The company mainly produces and operates polyurethane potting adhesives, sealants, and structural adhesives.

Gaoxin Tin Industry (Huizhou) Co., Ltd.

Tel:0752-6681186

Add: Xianan Industrial Zone, Yuanzhou Town, Boluo County, Guangdong Province

Kunshan Chengli Solder Manufacturing Co., Ltd.

Tel:0512-57875116

Add: No. 20-1 Zhuzhu Road, Lujia Town, Kunshan City, Jiangsu Province

Huizhou Chengli Industrial Co., Ltd.

Tel:0752-6805010

Add: G/F, Block B, Heli Industrial Center, 3-5 Wang Tai Road, Kowloon Bay, Hong Kong


Copyright © Kunshan Chengli Solder Manufacturing Co., Ltd.  Designed  By:www.300.cn  Business license