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Adhesive series

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Silicone Potting Compound

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Adhesive series products have various types of condensation curing systems and addition curing systems. Condensation curing system has the characteristics of convenient use and good adhesion to various conventional substrates, and is widely used in the bonding and fixing of various conventional components and components; addition curing system has higher temperature resistance than condensation curing system, Heat fast curing performance, used in a variety of challenging areas of the process.

1. Features of the product series
● Condensation-type products are fast to dry and fully cured after 48 hours
● Addition-type products are quickly cured or heat-cured
● Good adhesion to common substrates
● Various rheological products meet the needs of customers in different construction conditions
● A variety of stepped heat conduction products meet different thermal management needs
● Excellent flame retardant performance, passed UL94V-0 certification
● Excellent electrical insulation performance
● Comply with RoHs environmental protection requirements

2. Product use
● Bonding and reinforcement of electronic components
● Assembly and reinforcement of power modules ● Assembly and sealing of
lamps ●
Bonding assembly and sealing of auto parts
● Assembly of ordinary components
● Sealing and bonding of battery components

Product grade	2100	2100HT	2100N	2180	2300	2300LV	2320
features	One-component dealcoholization condensation type	One-component dealcoholization condensation type	One-component dealcoholization condensation type	One-component dealcoholization condensation type	One-component dealcoholization condensation type	One-component dealcoholization condensation type	One-component dealcoholization condensation type
Exterior	Thixotropic paste	micro flow	micro flow	Thixotropic paste	semi-fluid	flow	flow
color	black White	black White	black White	black/gray/white	black White	black White	translucent
Density (g/cm3)	1.7	1.9	1.5	1.4	1.3	1.3	1.0
viscosity	N.A	N.A	200000	N.A	40000	20000	20000
Before curing
The mixing ratio	N.A	N.A	N.A	N.A	N.A	N.A	N.A
Surface dry time (min)	15	10	6	15	20	20	15
Operating time (min)	N.A	N.A	N.A	N.A	N.A	N.A	N.A
curing conditions	Room temperature moisture curing	Room temperature moisture curing	Room temperature moisture curing	Room temperature moisture curing	Room temperature moisture curing	Room temperature moisture curing	Room temperature moisture curing
after curing
Hardness (Shore A)	65	70	40	40	35	35	25
Tensile strength (MPa)	2.0	2.2	1.5	2.2	1.5	1.6	0.8
Elongation at break (%)	70	60	15	300	160	130	120
Shear strength (MPa, Al-Al)	1.2	1.3	1.2	1.6	1.3	1.3	0.8
Thermal conductivity (W/m∙K)	0.8	1.0	0.6	0.5	0.4	0.4	0.2
Breakdown voltage (kV/mm)	≥18	≥18	≥18	≥18	≥18	≥18	≥18
Volume resistance (Ohm∙cm)	≥1×1014	≥1×1014	≥1×1014	≥1×1014	≥1×1014	≥1×1014	≥1×1014
Flame retardant grade	UL 94V-0	UL 94V-0	UL 94V-0	N.A	UL 94V-0	UL 94V-0	N.A

Product grade	2345	2600	2620	2800	4100L	4100	6200
features	One-component dealcoholization condensation type	One-component dealcoholization condensation type	One-component deketoxime condensation type	One-component addition type	Two-component condensation type	Two-component condensation type	One-component dealcoholization condensation type
Exterior	Thixotropic paste	micro flow	flow	semi-fluid	semi-fluid	Thixotropic	semi-fluid
color	translucent	White	red	translucent	black	black	black/gray/white
Density (g/cm3)	1.1	1.7	1.1	1.1	1.2	1.4	1.3
viscosity	N.A	N.A	6000	N.A	40000	200000	100000
Before curing
Mixing Ratio (Mass)	N.A	N.A	N.A	N.A	1:1	1:1	N.A
Surface dry time (min)	15	7	15	N.A	10	10	15
Operating time (min)	N.A	N.A	N.A	N.A	5	5	N.A
curing conditions	Room temperature moisture curing	Room temperature moisture curing	Room temperature moisture curing	30min@150℃	24h@25℃	24h@25℃	Room temperature moisture curing
after curing
Hardness (Shore A)	50	60	27	40	35	50	40
Tensile strength (MPa)	5.0	2.0	0.8	5	1.2	2.5	1.6
Elongation at break (%)	350	120	150	300	130	150	160
Shear strength (MPa, Al-Al)	2.0	1.5	0.8	3	1.0	1.5	1.2
Thermal conductivity (W/m∙K)	0.4	0.8	0.3	0.4	0.4	0.6	0.5
Breakdown voltage (kV/mm)	≥20	≥18	≥18	≥18	≥18	≥18	≥18
Volume resistance (Ohm∙cm)	≥1×1014	≥1×1014	≥1×1014	≥1×1014	≥1×1014	≥1×1014	≥1×1014
Flame retardant grade	N.A	UL 94V-0	N.A	N.A	N.A	N.A	UL 94V-0

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The company mainly produces and operates solder paste, solder bars, solder wire, anode plates (rods), anode balls and other related electronic welding materials.