With the high power and miniaturization of electronic components, heat dissipation devices need to have a good heat conduction medium to effectively transfer the generated heat to the environment, so as to avoid the problems of product performance and life caused by overheating of electronic components. The heat conduction product series of Huali New Materials is divided into two types: heat conduction silicone grease and heat conduction gel. They have good heat conduction, and you can choose a suitable heat conduction material according to various usage environments. The excellent interface contact formed can make heat conduction smooth. Delay device lifecycle. It is suitable for heat dissipation of computers, power supplies and automotive electronics. Such as CPU, communication equipment, power module, LED lamps and so on.

1. Features of the product series
● Excellent construction performance, glue can be applied manually and mechanically
● Excellent electrical insulation properties
● Wide operating temperature
● A variety of stepped heat conduction products meet different thermal management needs
● Multiple solutions meet different application scenarios
● Low oil separation rate
● Comply with RoHs, Reach environmental protection requirements

2. Product use
● CPU and heat sink gap filling heat transfer
● High-power triode, diode and base material (aluminum, copper) contact gap filling heat transfer
● Server, heat dissipation module and other radiator gap filling heat transfer
● Automotive electronics heat conduction