PRODUCTS

PRODUCTS

+
  • pr07.jpg

Leaded no-clean solder paste


Category:

Tin Lead Series

Recommended Products

Keywords:

Details

Details


 1. Product description
Leaded no-clean solder paste can infiltrate well with the coating of the circuit board, less solder balls, and the residue is colorless and transparent. Tin-lead solder paste is specially designed for surface mount process that requires long life, high-speed printing, and air reflow. It is suitable for SMT process, through-hole soldering process and automotive electronic soldering process. High-lead-tin-lead-silver solder paste is specially designed for the packaging process of semiconductor chips. According to customer requirements, there are different viscosities and cans and syringes.
 

2. Product Features
✰ The wire mesh has a long service life. Under various conditions, the sticking force can keep a small change for more than 8 hours.
✰ Printing speed up to 150mm/sec. ✰ Can
prevent solder balls under different humidity
✰ Excellent performance when soldering hard-to-wet OSP coatings
Applicable to various reflow curves and circuit board designs Board looks good.

 


3. Alloy composition

alloy

Melting temperature (°C)

IPC/J-STD-004 level

Sn63Pb37

183

R0L0

Sn60Pb40

185

R0L0

Sn62Pb36Ag2

178~190

R0L0

Sn62.8Pb36.8Ag0.4

178~190

R0L0

SnPb43Bi14

144~163

R0L0

Sn5Pb92.5Ag2.5

280

R0L0

 

4. How to use
: Warm up: Warm up to room temperature for 2-3 hours before solder paste is used, and open the cover when the temperature is above 19°C.
Template: stainless steel
Squeegee: stainless steel or rubber
Printing speed: According to the structure of the circuit board, the thickness of the steel plate and the printing capacity of the printing machine, the speed is generally 25-150mm/s.
Squeegee pressure: The length and speed of the squeegee are different. The squeegee does not leave solder paste after scraping the stencil. The usual pressure is about 200g/cm2.

 

ONLINE MESSAGE

*Note: Please be sure to fill in the information accurately, and keep the communication unblocked, we will get in touch with you as soon as possible

The company mainly produces and operates solder paste, solder bars, solder wire, anode plates (rods), anode balls and other related electronic welding materials.

The company mainly produces and operates polyurethane potting adhesives, sealants, and structural adhesives.

Hong Kong Chengxing Group Co., Ltd.

Tel:(852)27954549

Add:The company mainly produces and operates polyurethane potting adhesives, sealants, and structural adhesives.

Gaoxin Tin Industry (Huizhou) Co., Ltd.

Tel:0752-6681186

Add: Xianan Industrial Zone, Yuanzhou Town, Boluo County, Guangdong Province

Kunshan Chengli Solder Manufacturing Co., Ltd.

Tel:0512-57875116

Add: No. 20-1 Zhuzhu Road, Lujia Town, Kunshan City, Jiangsu Province

Huizhou Chengli Industrial Co., Ltd.

Tel:0752-6805010

Add: G/F, Block B, Heli Industrial Center, 3-5 Wang Tai Road, Kowloon Bay, Hong Kong


Copyright © Kunshan Chengli Solder Manufacturing Co., Ltd.  Designed  By:www.300.cn  Business license