1. Product description
Lead-free solder paste series products can meet various production needs, and are suitable for SMT process, radiator welding process, through-hole soldering process and automotive electronic soldering process, etc. According to customer requirements, there are different packaging methods, including cans and syringes.

2. Product features
✰ Outstanding lead-free reflow soldering yield, can get very good alloy fusion for small round solder joints. 
✰ Excellent printability can provide stable and consistent printing performance, suitable for long-term printing. 
✰ Can be used in high-speed printing, short printing cycle and high output. 
✰ Wide reflow temperature curve process window, good solderability for various board/component surface treatments. 
✰ Excellent appearance of solder joints and residues after reflow soldering, reducing the number of solder balls.

3. Alloy composition

4. How to use
: Warm up: Warm up to room temperature for 2-3 hours before solder paste is used, and open the cover when the temperature is above 19°C.
Template: stainless steel
Squeegee: stainless steel or rubber
Printing speed: According to the structure of the circuit board, the thickness of the steel plate and the printing capacity of the printing machine, the speed is generally 25-200mm/s.
Squeegee pressure: The length and speed of the squeegee are different. The squeegee does not leave solder paste after scraping the stencil. The usual pressure is 200g/cm2-~300g/cm2.