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Industry News
Decided to lead-free welding interconnection reliability of the seven factors
Abstract:
With more and more lead-free electronic products listed, reliability problems become the focus of many problems. And other lead-free related issues (such as alloy selection, process window, etc.) are different...
Kunshan shing lee solder manufacturing co., LTD. .
Abstract:
the science and technology in kunshan city, jiangsu province forward about 2006 of 20 high and new technology enterprise of the notice, the kunshan shing lee solder manufacturing co., LTD., which earned this batch of enterprise...
"The second green electronic international conference" successfully held in Beijing
Abstract:
By the ministry of information industry economy operation company ", "tsinghua university materials science and engineering research institute" host "the second green electronic international conference" held in Beijing smoothly...
The third China international patent &brand expo
Abstract:
In order to speed up the with independent intellectual property rights of new and high technology industrialization and product circulation nstruct platform;
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